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Double Layer MCPCB

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8 Layer PCB Built on FR-4 with BGA package
 
  1.1 General description
  This is a type of 8 layer printed circuit board built on FR-4 Tg170 substrate for the application of Wireless Communication. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supply 1 up board per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panels are packed for shipment.
 
  1.2 Features and benifits
  Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
High solderability, no stressing of circuit boards and less contamination of PCB surface.
Electrical test and high voltage test
Quick and on-time delivery
Money-saving, Worry-saving and Labor-saving
Free-of-charge PCB prototype test
 
  1.3 Application
  Led Light, Video Surveillance, File Server, Converters, Router USB, Electrical Converter, Cheap GPS Tracker, PLC Programing, Embedded System Applications, HVAC
   
  1.4 Parameter and data sheet
 
Base Material: IT-180, FR-4
Copper Weight: 1 oz each layer
Board Thickness: 1.6 mm ±10%
Layer Count: 8 layers
Board Size: 210.72 x 212.42mm=1UP
Solder Mask: Green solder mask | white silkscreen
Surface Finish: Immersion gold
Via: via tented
Warpage: ＜0.75%
Net Weight: 0.173 kg/pcs
Acceptable Standard: IPC-Class-2
Lead time for prototype: 10 working days
Shelflife: 6 months
   
 
 

 

 

 
　

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